JPS6334271Y2 - - Google Patents

Info

Publication number
JPS6334271Y2
JPS6334271Y2 JP1983131688U JP13168883U JPS6334271Y2 JP S6334271 Y2 JPS6334271 Y2 JP S6334271Y2 JP 1983131688 U JP1983131688 U JP 1983131688U JP 13168883 U JP13168883 U JP 13168883U JP S6334271 Y2 JPS6334271 Y2 JP S6334271Y2
Authority
JP
Japan
Prior art keywords
plunger
resin
resin material
molding machine
elastic pushing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1983131688U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6039243U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13168883U priority Critical patent/JPS6039243U/ja
Publication of JPS6039243U publication Critical patent/JPS6039243U/ja
Application granted granted Critical
Publication of JPS6334271Y2 publication Critical patent/JPS6334271Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP13168883U 1983-08-24 1983-08-24 半導体素子の樹脂封入成形機 Granted JPS6039243U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13168883U JPS6039243U (ja) 1983-08-24 1983-08-24 半導体素子の樹脂封入成形機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13168883U JPS6039243U (ja) 1983-08-24 1983-08-24 半導体素子の樹脂封入成形機

Publications (2)

Publication Number Publication Date
JPS6039243U JPS6039243U (ja) 1985-03-19
JPS6334271Y2 true JPS6334271Y2 (en]) 1988-09-12

Family

ID=30297636

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13168883U Granted JPS6039243U (ja) 1983-08-24 1983-08-24 半導体素子の樹脂封入成形機

Country Status (1)

Country Link
JP (1) JPS6039243U (en])

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2883704A (en) * 1953-05-28 1959-04-28 Us Rubber Co Transfer molding apparatus
JPS5821343A (ja) * 1981-07-29 1983-02-08 Matsushita Electric Ind Co Ltd 樹脂封止装置
JPS5839889U (ja) * 1981-09-10 1983-03-16 株式会社パイロット 万年筆
JPS5897838A (ja) * 1981-12-08 1983-06-10 Toshiba Corp 半導体用樹脂封止装置
JPS5943525A (ja) * 1982-09-03 1984-03-10 Kyowa Denki Kagaku Kk 電子部品の絶縁包装部の形成方法および装置

Also Published As

Publication number Publication date
JPS6039243U (ja) 1985-03-19

Similar Documents

Publication Publication Date Title
US4599062A (en) Encapsulation molding apparatus
CN103448187B (zh) 树脂密封成形装置
US5252051A (en) Resin-seal apparatus for semiconductor element
CN109382967A (zh) 搬运机构、树脂成型装置、成型对象物向成型模的交接方法及树脂成型品的制造方法
CN109382965A (zh) 树脂成型品的搬运机构、树脂成型装置以及树脂成型品的制造方法
CN109383047A (zh) 树脂成型装置以及树脂成型品的制造方法
US5366368A (en) Multi-plunger manual transfer mold die
JPS6233317Y2 (en])
US4388265A (en) Process and apparatus for molding plastics
JPS6334271Y2 (en])
KR100443316B1 (ko) 반도체 패키지 몰딩장치
KR102078722B1 (ko) 반도체 패키지 제조 장치
KR0160539B1 (ko) 수지 패키징 장치
KR960007278B1 (ko) 봉입성형용 모울딩 프레스 장치의 금형
JPS6382717A (ja) トランスファー成形型の金型装置
CN210525706U (zh) 一种异形瓶盖注塑模具
KR960004091B1 (ko) 매뉴얼 트랜스퍼 몰드다이의 제품취출장치
JP3650466B2 (ja) 樹脂モールド装置
JP3002226U (ja) 半導体素子の樹脂封止装置
CN118983230A (zh) 一种应用在热压伺服封装双层压机上的模具结构
JP2609849B2 (ja) 多品種少量生産に適した半導体封止用のマルチプランジヤー型樹脂モールド装置
JPH0356341Y2 (en])
JPH0719147Y2 (ja) 半導体素子の樹脂封止装置
KR101229836B1 (ko) 분할된 푸시블록들이 장착된 사출압축성형 금형 및 사출압축성형 방법
JP2903042B2 (ja) 多品種少量生産に適した半導体封止用のマルチプランジャー型樹脂モールド装置